GSO IEC 62047-25:2021

IEC 62047-25:2016

Gulf Standard Current Edition · Approved on 01 July 2021

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area

GSO IEC 62047-25:2021 Files

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GSO IEC 62047-25:2021 Scope

IEC 62047-25:2016 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS). This document is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.

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