GSO IEC 60191-5:2015
Gulf Standard
Current Edition
·
Approved on
03 September 2015
·
Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
GSO IEC 60191-5:2015 Files
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GSO IEC 60191-5:2015 Scope
This part of IEC 60191 on mechanical standardization gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. This standard is applicable to the finished component supplied by a manufacturer to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).
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