This part of IEC 603 covers dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits in dual-in-line format (see IEC 191-2 specified outlines, e.g. A-50). Sockets include standard type (see figures 6 and 7) and low-profile type (see figures 8 and 9). Sockets with terminations for through-board insertion are intended for use with printed boards using a basic grid of 2,54 mm (0,1 in) as laid down in IEC 97. Low-profile type sockets can be mounted side-by-side and end-to-end on a grid of 2,54 mm (0,1 in). This detail specification does not cover test/burn-in sockets.