This generic specification is applicable to film integrated circuits and to hybrid film integrated circuits (F and HFICs), both passive and active, as in IEC Publication 748-1, Chapter IV, Sub-clause 2.4. It applies also to partly-completed F and HFICs supplied to customers for subsequent processing. This specification also applies to chip carrier circuits having more than one chip, provided that they, as separate products, have been interconnected by film interconnection techniques. This specification is not intended to cover printed circuit boards but is applicable to F and HFICs which may include them.