This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of discrete electronic components. The purpose of this standard is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints. Each clause contains a specific set of clearly presented criteria providing information on the component, the component dimensions, the solder joint design and the land pattern dimensions.