This part of IEC 61192 specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting. It does not include metal or ceramic-based hybrid circuits in which the conductor metallization is deposited directly on a ceramic substrate or onto a ceramic-coated metal substrate.