GSO IEC 61191-3:2014
IEC 61191-3:1998
Gulf Standard
Current Edition
·
Approved on
25 December 2014
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
GSO IEC 61191-3:2014 Files
English
31 Pages
Current Edition
Reference Language
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GSO IEC 61191-3:2014 Scope
This standard prescribes requirements for lead and hole solder assembly. The requirements
pertain to those assemblies that are totally lead and hole, through-hole mounting technology
(THT), or the THT portions of those assemblies that include other related technologies (i.e.
surface mount, chip mounting, terminal mounting).
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