This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on four sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints. Each clause contains a specific set of criteria such that the information presented is consistent, providing information on the component, the component dimensions, the solder joint design and the land pattern dimensions. The land pattern dimensions are based on a mathematical model that establishes a platform for a solder joint attachment to the printed board. The existing models create a platform that is capable of establishing a reliable solder alloy used to make that joint (lead-free, tin lead, etc.). Process requirements for solder reflow are different based on the solder alloy and should be analyzed in order that the process is above that temperature a sufficient time to form a reliable metallurgical bond.