OS GSO IEC 61189-2-804:2024
IEC 61189-2-804:2023
Omani Standard
Current Edition
·
Approved on
14 October 2024
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
OS GSO IEC 61189-2-804:2024 Files
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OS GSO IEC 61189-2-804:2024 Scope
IEC 61189-2-804:2023 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.
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