OS GSO IEC 60191-6-22:2017
IEC 60191-6-22:2012
Omani Standard
Current Edition
·
Approved on
03 October 2017
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico
OS GSO IEC 60191-6-22:2017 Files
English
34 Pages
Current Edition
Reference Language
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OS GSO IEC 60191-6-22:2017 Scope
This part of IEC 60191 provides the outline drawings and dimensions common to siliconbased package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).
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