OS GSO IEC 60191-5:2015
IEC 60191-5:1997
Omani Standard
Current Edition
·
Approved on
03 September 2015
Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
OS GSO IEC 60191-5:2015 Files
English
71 Pages
Current Edition
Reference Language
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OS GSO IEC 60191-5:2015 Scope
This part of IEC 60191 on mechanical standardization gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. This standard is applicable to the finished component supplied by a manufacturer to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).
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